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Ceramic transient voltage suppressors
SMD multilayer transient voltage suppressors, standard series
Series/Type: Date: August 2008
(c) EPCOS AG 2008. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
Multilayer varistors (MLVs) Standard series
EPCOS type designation system for standard series CT
Construction: CT Single chip with nickel barrier termination (AgNiSn) CN Single chip with silver-palladium termination (AgPd) Case sizes: 0201 0402 0603 0805 1206 1210 1812 2220 Tolerance of the varistor voltage: K 10% L 15% M 20% S Special tolerance Maximum RMS operating voltage (VRMS): 17 17 V Taping mode: G 180-mm reel
0603
K
17
G
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
Features ESD acc. to IEC 61000-4-2 level 4 (8 kV contact, 15 kV air discharge) Surge current up to 1200 A Bidirectional protection No derating up to 125C (for case sizes 0603) Fast response (< 0.5 ns) RoHS-compatible CT version suitable for lead-free soldering PSpice simulation models available Applications ESD protection in mobile phones, cordless phones and accessories ESD protection in data bus applications ESD protection in control electronics, detectors and sensors, touch screens, plug-in cards, remote controls Design Multilayer technology Lack of plastic or epoxy encapsulation for flammability rating better than UL 94 V-0 Termination (see "Soldering directions"): CT types with nickel barrier terminations (AgNiSn), recommended for lead-free soldering, and compatible with tin/lead solder. CN types with silver-palladium terminations (AgPd) only suitable for reflow and wave soldering with solder on tin/lead basis. V/I characteristics and derating curves V/I and derating curves are attached to the data sheet. The curves are sorted by VRMS and then by case size, which is included in the type designation.
Single chip Internal circuit
Available case sizes: EIA 0201 0402 0603 0805 1206 1210 1812 2220 Metric 0603 1005 1608 2012 3216 3225 4532 5750
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
General technical data Maximum RMS operating voltage Maximum DC operating voltage Maximum surge current Maximum energy absorption Maximum power dissipation Maximum clamping voltage Operating temperature Storage temperature VRMS,max VDC,max Isurge,max Wmax Pdiss,max Vclamp,max Top Top Tstg Tstg 4 ... 60 5.5 ... 85 10 ... 1200 7.5 ... 12000 3 ... 20 17 ... 165 40/+85 55/+125 40/+125 55/+150 V V A mJ mW V C C C C
(8/20 s) (2 ms) (8/20 s) for case size 0201, 0402 for case size 0603 for case size 0201, 0402 for case size 0603
Temperature derating Climatic category: 40/+85 C for case size 0201 and 0402 Climatic category: 55/+125 C for case size 0603
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
Electrical specifications and ordering codes Maximum ratings (Top,max) Type Ordering code VRMS,max VDC,max V CN standard series CN1812M4G CN2220M4G CN1812M6G CN2220M6G CN1812L8G CN2220L8G CN1812K11G CN2220K11G CN1812K14G CN2220K14G CN1812K17G CN2220K17G CN1812K20G CN2220K20G CN1812K25G CN2220K25G CN1812K30G CN2220K30G CT standard series CT0201S4AG CT0402M4G CT0603M4G CT0805M4G CT1206M4G CT1210M4G CT0603M6G CT0805M6G CT1206M6G CT1210M6G CT0603K7G CT0603M7G CT0603L8G CT0805L8G CT1206L8G CT1210L8G CT0402S11AG CT0603K11G B72580V0040M062 B72540V0040M062 B72580V0060M062 B72540V0060M062 B72580V0080L062 B72540V0080L062 B72580V0110K062 B72540V0110K062 B72580V0140K062 B72540V0140K062 B72580V0170K062 B72540V0170K062 B72580V0200K062 B72540V0200K062 B72580V0250K062 B72540V0250K062 B72580V0300K062 B72540V0300K062 B72440T0040S160 B72590T0040M060 B72500T0040M060 B72510T0040M062 B72520T0040M062 B72530T0040M062 B72500T0060M060 B72510T0060M062 B72520T0060M062 B72530T0060M062 B72500T0070K060 B72500T0070M060 B72500T0080L060 B72510T0080L062 B72520T0080L062 B72530T0080L062 B72590T0110S160 B72500T0110K060 4 4 6 6 8 8 11 11 14 14 17 17 20 20 25 25 30 30 4 4 4 4 4 4 6 6 6 6 7 7 8 8 8 8 11 11 V 5.5 5.5 8 8 11 11 14 14 18 18 22 22 26 26 31 31 38 38 5.5 5.5 5.5 5.5 5.5 5.5 8 8 8 8 9 9 11 11 11 11 14 14 Isurge,max Wmax (8/20 s) (2 ms) A mJ 500 1000 500 1200 800 1200 800 1200 800 1200 800 1200 800 1200 800 1200 800 1200 20 30 100 150 250 30 120 200 300 30 30 30 120 200 400 20 30 800 1400 1000 3600 1800 4200 1900 5400 2300 5800 2700 7200 3000 7800 3700 9600 4200 12000 7.5 100 100 300 400 100 200 400 700 100 100 100 200 500 1000 7.5 200 Pdiss,max Top,max mW 15 20 15 20 15 20 15 20 15 20 15 20 15 20 15 20 15 20 3 3 5 8 10 3 5 8 10 3 3 3 5 8 10 3 3 C +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +85 +85 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +85 +125
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series Characteristics (TA = 25 C) Type VV (1 mA) V 8 8 11 11 15 15 18 18 22 22 27 27 33 33 39 39 47 47 15 10 8 8 8 8 11 11 11 11 12.5 12.5 15 15 15 15 18.4 18 VV % 20 20 20 20 15 15 10 10 10 10 10 10 10 10 10 10 10 10 20 20 20 20 20 20 20 20 20 20 10 20 15 15 15 15 10 10 Vclamp,max V 17 17 25 25 30 30 33 33 38 38 44 44 54 54 65 65 77 77 35 24 19 19 17 17 27 27 25 25 27 30 33 33 30 30 35 35 Iclamp (8/20 s) A 5 10 5 10 5 10 5 10 5 10 5 10 5 10 5 10 5 10 1 1 1 1 1 2.5 1 1 1 2.5 1 1 1 1 1 2.5 1 1 Ctyp (1 kHz, 1 V) pF 10000 24000 8000 20000 6000 16000 5000 12000 4500 10000 4000 9000 3000 7000 2500 5000 2000 4000 221) 2001) 200 700 1500 5000 200 600 1200 4000 130 200 150 500 1000 3000 1201) 100
CN standard series CN1812M4G CN2220M4G CN1812M6G CN2220M6G CN1812L8G CN2220L8G CN1812K11G CN2220K11G CN1812K14G CN2220K14G CN1812K17G CN2220K17G CN1812K20G CN2220K20G CN1812K25G CN2220K25G CN1812K30G CN2220K30G CT standard series CT0201S4AG CT0402M4G CT0603M4G CT0805M4G CT1206M4G CT1210M4G CT0603M6G CT0805M6G CT1206M6G CT1210M6G CT0603K7G CT0603M7G CT0603L8G CT0805L8G CT1206L8G CT1210L8G CT0402S11AG CT0603K11G
1) Measured @ 1 MHz, 1 V
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
Electrical specifications and ordering codes Maximum ratings (Top,max) Type Ordering code VRMS,max VDC,max V CT standard series CT0805K11G CT1206K11G CT1210K11G CT0402L14G CT0402L14UG CT0603K14G CT0603S14BG CT0805K14G CT1206K14G CT1210K14G CT0402S17AG CT0603K17G CT0805K17G CT1206K17G CT1210K17G CT0603K20G CT0805K20G CT1206K20G CT1210K20G CT0603K25G CT0805K25G CT1206K25G CT1210K25G CT0805K30G CT1206K30G CT1210K30G CT1206K35G CT1210K35G CT1206K40G CT1210K40G CT1206K50G CT1210K50G CT1206K60G CT1210K60G B72510T0110K062 B72520T0110K062 B72530T0110K062 B72590T0140L060 B72590T0140L960 B72500T0140K060 B72500T0140S160 B72510T0140K062 B72520T0140K062 B72530T0140K062 B72590T0170S160 B72500T0170K060 B72510T0170K062 B72520T0170K062 B72530T0170K062 B72500T0200K060 B72510T0200K062 B72520T0200K062 B72530T0200K062 B72500T0250K060 B72510T0250K062 B72520T0250K062 B72530T0250K062 B72510T0300K062 B72520T0300K062 B72530T0300K062 B72520T0350K062 B72530T0350K062 B72520T0400K062 B72530T0400K062 B72520T0500K062 B72530T0500K062 B72520T0600K062 B72530T0600K062 11 11 11 14 14 14 14 14 14 14 17 17 17 17 17 20 20 20 20 25 25 25 25 30 30 30 35 35 40 40 50 50 60 60 V 14 14 14 16 16 18 18 18 18 18 19 22 22 22 22 26 26 26 26 31 31 31 31 38 38 38 45 45 56 56 65 65 85 85 Isurge,max Wmax (8/20 s) (2 ms) A mJ 120 200 400 20 10 30 30 120 200 400 20 30 120 200 400 30 80 200 400 30 80 200 300 80 200 300 100 250 100 250 100 200 100 200 200 500 1200 10 10 200 200 300 500 1500 10 200 300 600 1700 200 300 700 1900 300 300 1000 1700 300 1100 2000 400 2000 500 2300 600 1600 700 2000 Pdiss,max Top,max mW 5 8 10 3 3 3 3 5 8 10 3 3 5 8 10 3 5 8 10 3 5 8 10 5 8 10 8 10 8 10 8 10 8 10 C +125 +125 +125 +85 +85 +125 +125 +125 +125 +125 +85 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series Characteristics (TA = 25 C) Type VV (1 mA) V 18 18 18 23.5 23.5 22 22 22 22 22 32 27 27 27 27 33 33 33 33 39 39 39 39 47 47 47 56 56 68 68 82 82 100 100 VV % 10 10 10 15 15 10 +23/ 0 10 10 10 25 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 Vclamp,max V 35 33 33 46 46 40 42 40 38 38 59 46 46 44 44 56 56 54 54 67 67 65 65 77 77 77 90 90 110 110 135 135 165 165 Iclamp (8/20 s) A 1 1 2.5 1 1 1 1 1 1 2.5 1 1 1 1 2.5 1 1 1 2.5 1 1 1 2.5 1 1 2.5 1 2.5 1 2.5 1 2.5 1 2.5 Ctyp (1 kHz, 1 V) pF 400 800 2400 471) 471) 100 120 350 700 2000 331) 100 400 650 1800 90 300 600 1500 901) 250 550 1200 200 500 1000 200 600 250 500 120 250 100 200
CT standard series CT0805K11G CT1206K11G CT1210K11G CT0402L14G CT0402L14UG CT0603K14G CT0603S14BG CT0805K14G CT1206K14G CT1210K14G CT0402S17AG CT0603K17G CT0805K17G CT1206K17G CT1210K17G CT0603K20G CT0805K20G CT1206K20G CT1210K20G CT0603K25G CT0805K25G CT1206K25G CT1210K25G CT0805K30G CT1206K30G CT1210K30G CT1206K35G CT1210K35G CT1206K40G CT1210K40G CT1206K50G CT1210K50G CT1206K60G CT1210K60G
1) Measured @ 1MHz, 1 V
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
Dimensional drawing
Dimensions in mm Case size EIA / mm 0201 / 0603 0402 / 1005 0603 / 1608 0805 / 2012 1206 / 3216 1210 / 3225 1812 / 4532 2220 / 5750 l 0.6 0.03 1.0 0.15 1.6 0.15 2.0 0.20 3.2 0.30 3.2 0.30 4.5 0.40 5.7 0.40 w 0.30 0.03 0.50 0.10 0.80 0.10 1.25 0.15 1.60 0.20 2.50 0.25 3.20 0.30 5.00 0.40 h 0.33 max. 0.6 max. 0.9 max. 1.4 max. 1.7 max. 1.7 max. 2.5 max. 2.5 max. k 0.15 0.05 0.10 ... 0.30 0.10 ... 0.40 0.13 ... 0.75 0.25 ... 0.75 0.25 ... 0.75 0.25 ... 1.00 0.25 ... 1.00
Recommended solder pad layout Dimensions in mm Case size EIA / mm 0201 / 0603 0402 / 1005 0603 / 1608 0805 / 2012 1206 / 3216 1210 / 3225 1812 / 4532 2220 / 5750 A 0.30 0.60 1.00 1.40 1.80 2.80 3.60 5.50 B 0.25 0.60 1.00 1.20 1.20 1.20 1.50 1.50 C 0.30 0.50 1.00 1.00 2.10 2.10 3.00 4.20
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
Delivery mode EIA case size Taping 0201 0402 0402 0402 0402 0402 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0805 0805 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Reel size mm 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 Packing unit pcs. 15000 10000 10000 10000 10000 10000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 2000 2000 2000 2000 2000 2000 3000 3000 3000 3000 3000 3000 Type CT0201S4AG CT0402L14G CT0402L14UG CT0402M4G CT0402S11AG CT0402S17AG CT0603K11G CT0603K14G CT0603K17G CT0603K20G CT0603K25G CT0603K7G CT0603L8G CT0603M4G CT0603M6G CT0603M7G CT0603S14BG CT0805K11G CT0805K14G CT0805K17G CT0805K20G CT0805K25G CT0805K30G CT0805L8G CT0805M4G CT0805M6G CT1206K11G CT1206K14G CT1206K17G CT1206K20G CT1206K25G CT1206K30G CT1206K35G CT1206K40G CT1206K50G CT1206K60G CT1206L8G CT1206M4G CT1206M6G CT1210K11G CT1210K14G CT1210K17G Ordering code B72440T0040S160 B72590T0140L060 B72590T0140L960 B72590T0040M060 B72590T0110S160 B72590T0170S160 B72500T0110K060 B72500T0140K060 B72500T0170K060 B72500T0200K060 B72500T0250K060 B72500T0070K060 B72500T0080L060 B72500T0040M060 B72500T0060M060 B72500T0070M060 B72500T0140S160 B72510T0110K062 B72510T0140K062 B72510T0170K062 B72510T0200K062 B72510T0250K062 B72510T0300K062 B72510T0080L062 B72510T0040M062 B72510T0060M062 B72520T0110K062 B72520T0140K062 B72520T0170K062 B72520T0200K062 B72520T0250K062 B72520T0300K062 B72520T0350K062 B72520T0400K062 B72520T0500K062 B72520T0600K062 B72520T0080L062 B72520T0040M062 B72520T0060M062 B72530T0110K062 B72530T0140K062 B72530T0170K062
Please read Cautions and warnings and Important notes at the end of this document.
Page 10 of 75
Multilayer varistors (MLVs) Standard series
EIA case size Taping 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 1812 1812 1812 1812 1812 2220 2220 2220 2220 2220 2220 2220 2220 2220 Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister
Reel size Packing unit mm pcs. 180 3000 180 2000 180 2000 180 2000 180 2000 180 2000 180 2000 180 3000 180 3000 180 3000 180 1500 180 1500 180 1500 180 1500 180 1000 180 1000 180 1500 180 1500 180 1500 180 1500 180 1500 180 1500 180 1500 180 1000 180 1000 180 1500 180 1500 180 1500
Type CT1210K20G CT1210K25G CT1210K30G CT1210K35G CT1210K40G CT1210K50G CT1210K60G CT1210L8G CT1210M4G CT1210M6G CN1812K11G CN1812K14G CN1812K17G CN1812K20G CN1812K25G CN1812K30G CN1812L8G CN1812M4G CN1812M6G CN2220K11G CN2220K14G CN2220K17G CN2220K20G CN2220K25G CN2220K30G CN2220L8G CN2220M4G CN2220M6G
Ordering code B72530T0200K062 B72530T0250K062 B72530T0300K062 B72530T0350K062 B72530T0400K062 B72530T0500K062 B72530T0600K062 B72530T0080L062 B72530T0040M062 B72530T0060M062 B72580V0110K062 B72580V0140K062 B72580V0170K062 B72580V0200K062 B72580V0250K062 B72580V0300K062 B72580V0080L062 B72580V0040M062 B72580V0060M062 B72540V0110K062 B72540V0140K062 B72540V0170K062 B72540V0200K062 B72540V0250K062 B72540V0300K062 B72540V0080L062 B72540V0040M062 B72540V0060M062
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
V/I characteristics
CT0201S4AG
CT0402M4G
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
V/I characteristics
CT0402S11AG
CT0402L14G
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
V/I characteristics
CT0402L14UG
CT0402S17AG
Please read Cautions and warnings and Important notes at the end of this document.
Page 14 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT0603M4G
CT0603M6G
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
V/I characteristics
CT0603K7G
CT0603M7G
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
V/I characteristics
CT0603L8G
CT0603K11G
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
V/I characteristics
CT0603K14G
CT0603S14BG
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
V/I characteristics
CT0603K17G
CT0603K20G
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
V/I characteristics
CT0603K25G
CT0805M4G
Please read Cautions and warnings and Important notes at the end of this document.
Page 20 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT0805M6G
CT0805L8G
Please read Cautions and warnings and Important notes at the end of this document.
Page 21 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT0805K11G
CT0805K14G
Please read Cautions and warnings and Important notes at the end of this document.
Page 22 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT0805K17G
CT0805K20G
Please read Cautions and warnings and Important notes at the end of this document.
Page 23 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT0805K25G
CT0805K30G
Please read Cautions and warnings and Important notes at the end of this document.
Page 24 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT1206M4G
CT1206M6G
Please read Cautions and warnings and Important notes at the end of this document.
Page 25 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT1206L8G
CT1206K11G
Please read Cautions and warnings and Important notes at the end of this document.
Page 26 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT1206K14G
CT1206K17G
Please read Cautions and warnings and Important notes at the end of this document.
Page 27 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT1206K20G
CT1206K25G
Please read Cautions and warnings and Important notes at the end of this document.
Page 28 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT1206K30G
CT1206K35G
Please read Cautions and warnings and Important notes at the end of this document.
Page 29 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT1206K40G
CT1206K50G
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Page 30 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT1206K60G
CT1210M4
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Page 31 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT1210M6G
CT1210L8G
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Page 32 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT1210K11G
CT1210K14G
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Page 33 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT1210K17G
CT1210K20G
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Page 34 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT1210K25G
CT1210K30G
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Page 35 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT1210K35G
CT1210K40G
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Page 36 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CT1210K50G
CT1210K60G
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Page 37 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CN1812M4G
CN1812M6G
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Page 38 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CN1812L8G
CN1812K11G
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Page 39 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CN1812K14G
CN1812K17G
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Page 40 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CN1812K20G
CN1812K25G
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Page 41 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CN1812K30G
CN2220M4G
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Page 42 of 75
Multilayer varistors (MLVs) Standard series
V/I characteristics
CN2220M6G
CN2220L8G
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Multilayer varistors (MLVs) Standard series
V/I characteristics
CN2220K11G
CN2220K14G
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Multilayer varistors (MLVs) Standard series
V/I characteristics
CN2220K17G
CN2220K20G
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Multilayer varistors (MLVs) Standard series
V/I characteristics
CN2220K25G
CN2220K30G
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Multilayer varistors (MLVs) Standard series
Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CT0402M4G ... S17AG
CT0402L14UG
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Multilayer varistors (MLVs) Standard series
Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CT0603M4G ... K25G
CT0805M4G CT1206K35G ... K60G
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CT0805M6G ... K17G
CT0805K20G ... K30G
Please read Cautions and warnings and Important notes at the end of this document.
Page 49 of 75
Multilayer varistors (MLVs) Standard series
Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CT1206M4G
CT1206M6G ... K30G CT1210K50G ... K60G
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Page 50 of 75
Multilayer varistors (MLVs) Standard series
Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CT1210M4G
CT1210K35G ... K40G
CT1210M6G
CT1210K25G ... K30G
Please read Cautions and warnings and Important notes at the end of this document.
Page 51 of 75
Multilayer varistors (MLVs) Standard series
Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CT1210L8G ... K20G
CN1812M4G ... M6G
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer varistors (MLVs) Standard series
Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CN1812L8G ... K30G
CN2220M4G
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Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2
CN2220M6G ... K30G
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Taping and packing 1 1.1 Taping and packing for SMD components Blister tape (the taping to IEC 60286-3)
Dimensions in mm 8-mm tape Case size (inch/mm) 0508/ 1220 0603/ 1608 A0 B0 K0 T T2 D0 D1 P0 P2 P1 W E F G
1) 0.2 mm over 10 sprocket holes.
12-mm tape Case size (inch/mm) 1012/ 2532 1210/ 3225 2.80 3.50 1812/ 4532 3.50 4.80 2.60 0.30 3.50 1.50 1.50 4.00 2.00 8.00 12.00 1.75 5.50 0.75 2220/ 5750 5.10 6.00
16-mm tape Case size (inch/mm) Tolerance
0612/ 1632 1206/ 3216 1.90 3.50 1.80
0506/ 1216 1.50 1.80 0.80
0805/ 2012 1.60 2.40 0.30
3225 4032 7.00 8.60 0.20 max. max. max. +0.10/ 0 min. 0.101) 0.05 0.10 0.30 0.10 0.05 min.
0.9 0.10 1.75 0.10 1.0 1.3
8.70 10.60 0.20 5.00 0.30 5.50 1.50 1.50 4.00 2.00 12.00 16.00 1.75 7.50 0.75
1.20 1.50 1.00 4.00 2.00 4.00 8.00 1.75 3.50 0.75
2.50
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Part orientation in tape pocket for blister tape For discrete chip, case sizes 0603, 0805, 1206, 1210, 1812 and 2220 For array, case sizes 0612
For arrays 0506 and 1012
For filter array, case size 0508
Additional taping information Reel material Tape material Tape break force Top cover tape strength Top cover tape peel force Tape peel angle Cavity play Polystyrol (PS) Polystyrol (PS) or Polycarbonat (PC) or PVC min. 10 N min. 10 N 0.2 to 0.6 N for 8-mm tape and 0.2 to 0.8 N for 12-mm tape at a peel speed of 300 mm/min Angle between top cover tape and the direction of feed during peel off: 165 to 180 Each part rests in the cavity so that the angle between the part and cavity center line is no more than 20
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1.2
Cardboard tape (taping to IEC 60286-3)
Dimensions in mm 8-mm tape Case size (inch/mm) Case size Tolerance (inch/mm) 0.95 1.80 0.95 1.10 1.50 4.00 2.00 2.00 0.05 2.00 4.00 8.00 1.75 3.50 1.35 0.75 4.00 4.00 4.00 1.00 2.85 1.00 1.10 1.60 2.40 0.95 1.12 1.50 0.20 0.20 max. max. +0.10/ 0 0.102) 0.05 0.10 0.30 0.10 0.05 min.
0201/0603 0402/1005 0405/1012 0603/1608 1003/2508 0508/1220 A0 B0 T T2 D0 P0 P2 P1 W E F G
2) 0.2 mm over 10 sprocket holes.
0.38 0.05 0.68 0.05 0.35 0.02 0.4 min. 1.50 0.1
0.60 1.15 0.60 0.70
1.05 1.60 0.75 0.90
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Part orientation in tape pocket for cardboard tape For discrete chip case sizes 0201, 0402, 0603 and 1003 For array case size 0405
For array case size 0508
For filter array, case size 0405
Additional taping information Reel material Tape material Tape break force Top cover tape strength Top cover tape peel force Tape peel angle Cavity play Polystyrol (PS) Cardboard min. 10 N min. 10 N 0.1 to 0.65 N at a peel speed of 300 mm/min Angle between top cover tape and the direction of feed during peel off: 165 to 180 Each part rests in the cavity so that the angle between the part and cavity center line is no more than 20
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1.3
Reel packing
Dimensions in mm 8-mm tape 180-mm reel A W1 W2 180 3/+0 330-mm reel 330 2.0 12-mm tape 180-mm reel 180 3/+0 330-mm reel 330 2.0 16-mm tape 330-mm reel 330 2.0
8.4 +1.5/ 0 14.4 max.
8.4 +1.5/ 0 14.4 max.
12.4 +1.5/ 0 18.4 max.
12.4 +1.5/ 0 18.4 max.
16.4 +1.5/ 0 22.4 max.
Leader, trailer
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Soldering directions 1 1.1 Terminations Nickel barrier termination
The nickel barrier layer of the silver/nickel/tin termination prevents leaching of the silver base metallization layer. This allows great flexibility in the selection of soldering parameters. The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel barrier termination is suitable for all commonly-used soldering methods.
Multilayer CTVS: Structure of nickel barrier termination 1.2 Silver-palladium termination
Silver-palladium terminations are used for the large case sizes 1812 and 2220 and for chips intended for conductive adhesion. This metallization improves the resistance of large chips to thermal shock. In case of conductive adhesion, the silver-palladium metallization reduces susceptibility to corrosion. Silver-palladium termination can be used for smaller case sizes (only chip) for hybrid applications as well. The silver-palladium termination is not approved for lead-free soldering.
Multilayer varistor: Structure of silver-palladium termination
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2 2.1
Recommended soldering temperature profiles Reflow soldering temperature profile
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D
Profile feature Preheat and soak - Temperature min - Temperature max - Time Average ramp-up rate Liquidous temperature Time at liquidous Peak package body temperature Time (tP)3) within 5 C of specified classification temperature (Tc) Average ramp-down rate Time 25 C to peak temperature
Sn-Pb eutectic assembly Tsmin Tsmax tsmin to tsmax Tsmax to Tp TL tL Tp1) 100 C 150 C 60 ... 120 s 3 C/ s max. 183 C 60 ... 150 s 220 C ... 235 C2) 20 s3) Tp to Tsmax 6 C/ s max. maximum 6 min
Pb-free assembly 150 C 200 C 60 ... 180 s 3 C/ s max. 217 C 60 ... 150 s 245 C ... 260 C2) 30 s3) 6 C/ s max. maximum 8 min
1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum. 2) Depending on package thickness. For details please refer to JEDEC J-STD-020D. 3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3
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2.2
Wave soldering temperature profile
Temperature characteristics at component terminal with dual-wave soldering
2.3
Lead-free soldering processes
EPCOS multilayer CTVS with AgNiSn termination are designed for the requirements of lead-free soldering processes only. Soldering temperature profiles to JEDEC J-STD-020D, IEC 60068-2-58 and ZVEI recommendations.
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3 3.1 Type
Recommended soldering methods - type-specific releases by EPCOS Overview Reflow soldering Case size 0201/ 0402 0603 ... 2220 0603 ... 2220 0405 ... 1012 3225, 4032 SnPb Approved Approved Approved Approved Approved Approved No Lead-free Approved Approved No Approved Approved Approved No Wave soldering SnPb No Approved Approved No No Approved Approved Lead-free No Approved No No No Approved Approved
CT... / CD... CT... / CD... CN... Arrays CU SHCV 3.2
ESD/EMI filters 0405, 0508
Nickel barrier terminated multilayer CTVS
All EPCOS MLVs with nickel barrier termination are suitable and fully qualiyfied for lead-free soldering. The nickel barrier layer is 100% matte tin-plated. 3.3 Silver-palladium terminated MLVs
AgPd-terminated MLVs are mainly designed for conductive adhesion technology on hybrid material. Additionally MLVs with AgPd termination are suitable for reflow and wave soldering with SnPb solder. Note: Lead-free soldering is not approved for MLVs with AgPd termination. 3.4 Tinned copper alloy
All EPCOS CU types with tinned termination are approved for lead-free and SnPb soldering. 3.5 Tinned iron wire
All EPCOS SHCV types with tinned termination are approved for lead-free and SnPb soldering.
4 4.1
Solder joint profiles / solder quantity Nickel barrier termination
If the meniscus height is too low, that means the solder quantity is too low, the solder joint may break, i.e. the component becomes detached from the joint. This problem is sometimes interpreted as leaching of the external terminations.
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If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur. As the solder cools down, the solder contracts in the direction of the component. If there is too much solder on the component, it has no leeway to evade the stress and may break, as in a vise. The figures below show good and poor solder joints for dual-wave and infrared soldering. 4.1.1 Solder joint profiles for nickel barrier termination - dual-wave soldering
Good and poor solder joints caused by amount of solder in dual-wave soldering. 4.1.2 Solder joint profiles for nickel barrier termination / silver-palladium termination - reflow soldering
Good and poor solder joints caused by amount of solder in reflow soldering.
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Multilayer varistors (MLVs) Standard series
5
Conductive adhesion
Attaching surface-mounted devices (SMDs) with electrically conductive adhesives is a commercially attractive method of component connection to supplement or even replace conventional soldering methods. Electrically conductive adhesives consist of a non-conductive plastic (epoxy resin, polyimide or silicon) in which electrically conductive metal particles (gold, silver, palladium, nickel, etc) are embedded. Electrical conduction is effected by contact between the metal particles. Adhesion is particularly suitable for meeting the demands of hybrid technology. The adhesives can be deposited ready for production requirements by screen printing, stamping or by dispensers. As shown in the following table, conductive adhesion involves two work operations fewer than soldering. Reflow soldering Screen-print solder paste Mount SMD Predry solder paste Reflow soldering Wash Inspect Wave soldering Apply glue dot Mount SMD Cure glue Wave soldering Wash Inspect Conductive adhesion Screen-print conductive adhesive Mount SMD Cure adhesive Inspect
A further advantage of adhesion is that the components are subjected to virtually no temperature shock at all. The curing temperatures of the adhesives are between 120 C and 180 C, typical curing times are between 30 minutes and one hour. The bending strength of glued chips is, in comparison with that of soldered chips, higher by a factor of at least 2, as is to be expected due to the elasticity of the glued joints. The lower conductivity of conductive adhesive may lead to higher contact resistance and thus result in electrical data different to those of soldered components. Users must pay special attention to this in RF applications.
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6 Test
Solderability tests Standard Test conditions Sn-Pb soldering Test conditions Pb-free soldering Immersion in Sn96.5Ag3.0Cu0.5 solder using non- or low activated flux at 245 5 C for 3 0.3 s Criteria/ test results Covering of 95% of end termination, checked by visual inspection
Wettability
IEC Immersion in 60068-2-58 60/40 SnPb solder using non-activated flux at 215 3 C for 3 0.3 s IEC Immersion in 60068-2-58 60/40 SnPb solder using mildly activated flux without preheating at 260 5 C for 10 1 s Dip soldering at 300 C/5 s
Leaching resistance
Immersion in No leaching of Sn96.5Ag3.0Cu0.5 contacts solder using non- or low activated flux without preheating at 255 5 C for 10 1 s Dip soldering at 300 C/5 s No deterioration of electrical parameters. Capacitance change: 15% Change of varistor voltage: 5% Change of varistor voltage: 5% Change of capacitance X7R: 5/+10%
Thermal shock (solder shock)
Tests of resistance IEC Immersion in Immersion in to soldering heat 60068-2-58 60/40 SnPb for 10 s Sn96.5Ag3.0Cu0.5 for SMDs at 260 C for 10 s at 260 C Tests of resistance IEC to soldering heat 60068-2-20 for radial leaded components (SHCV) Immersion of leads in 60/40 SnPb for 10 s at 260 C Immersion of leads in Sn96.5Ag3.0Cu0.5 for 10 s at 260 C
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Note: Leaching of the termination Effective area at the termination might be lost if the soldering temperature and/or immersion time are not kept within the recommended conditions. Leaching of the outer electrode should not exceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B, shown below as mounted on substrate.
As a single chip
As mounted on substrate
7 7.1
Notes for proper soldering Preheating and cooling
According to JEDEC J-STD-020D. Please refer to chapter 2. 7.2 Repair / rework
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for rework purposes. 7.3 Cleaning
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning solution according to the type of flux used. The temperature difference between the components and cleaning liquid must not be greater than 100 C. Ultrasonic cleaning should be carried out with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metallized surfaces. 7.4 Solder paste printing (reflow soldering)
An excessive application of solder paste results in too high a solder fillet, thus making the chip more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be applied smoothly to the end surface.
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7.5
Adhesive application
Thin or insufficient adhesive causes chips to loosen or become disconnected during curing. Low viscosity of the adhesive causes chips to slip after mounting. It is advised to consult the manufacturer of the adhesive on proper usage and amounts of adhesive to use. 7.6 Selection of flux
Used flux should have less than or equal to 0.1 wt % of halogenated content, since flux residue after soldering could lead to corrosion of the termination and/or increased leakage current on the surface of the component. Strong acidic flux must not be used. The amount of flux applied should be carefully controlled, since an excess may generate flux gas, which in turn is detrimental to solderability. 7.7 Storage of CTVSs
Solderability is guaranteed for one year from date of delivery for multilayer varistors, CeraDiodes and ESD/EMI filters (half a year for chips with AgPd terminations) and two years for SHCV and CU components, provided that components are stored in their original packages. Storage temperature: 25 C to +45 C Relative humidity: 75% annual average, 95% on 30 days a year The solderability of the external electrodes may deteriorate if SMDs and leaded components are stored where they are exposed to high humidity, dust or harmful gas (hydrogen chloride, sulfurous acid gas or hydrogen sulfide). Do not store SMDs and leaded components where they are exposed to heat or direct sunlight. Otherwise the packing material may be deformed or SMDs/ leaded components may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, it is recommended to use the SMDs or leaded components as soon as possible. 7.8 Placement of components on circuit board
Especially in the case of dual-wave soldering, it is of advantage to place the components on the board before soldering in that way that their two terminals do not enter the solder bath at different times. Ideally, both terminals should be wetted simultaneously. 7.9 Soldering cautions
An excessively long soldering time or high soldering temperature results in leaching of the outer electrodes, causing poor adhesion and a change of electrical properties of the varistor due to the loss of contact between electrodes and termination. Wave soldering must not be applied for MLVs designated for reflow soldering only. Keep the recommended down-cooling rate.
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7.10
Standards
CECC 00802 IEC 60068-2-58 IEC 60068-2-20 JEDEC J-STD-020D
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Symbols and terms Symbol Cline,typ Cmax Cmin Cnom Cnom Ctyp fcut-off,min I Iclamp Ileak Ileak,typ IPP Isurge,max LCT Ltyp Pdiss,max PPP Rins Rmin RS TA Top Tstg tr tresp UCT V VBR,min Vclamp,max VDC,max VESD,air VESD,contact Vjump Term Typical capacitance per line Maximum capacitance Minimum capacitance Nominal capacitance Tolerance of nominal capacitance Typical capacitance Minimum cut-off frequency Current Clamping current Leakage current Typical leakage current Peak pulse current Maximum surge current (also termed peak current) Lower category temperature Typical inductance Maximum power dissipation Peak pulse power Insulation resistance Minimum resistance Resistance per line Ambient temperature Operating temperature Storage temperature Duration of equivalent rectangular wave Response time Upper category temperature Voltage Minimum breakdown voltage Maximum clamping voltage Maximum DC operating voltage (also termed working voltage) Air discharge ESD capability Contact discharge ESD capability Maximum jump start voltage
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Multilayer varistors (MLVs) Standard series
VRMS,max VV VV,min VV,max VV WLD Wmax typ *
Maximum AC operating voltage, root-mean-square value Varistor voltage (also termed breakdown voltage) Minimum varistor voltage Maximum varistor voltage Tolerance of varistor voltage Maximum load dump Maximum energy absorption (also termed transient energy) Typical insertion loss Lead spacing Maximum possible application conditions
All dimensions are given in mm. The commas used in numerical values denote decimal points.
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Cautions and warnings General Some parts of this publication contain statements about the suitability of our ceramic transient voltage suppressor (CTVS) components (multilayer varistors (MLVs), CeraDiodes, ESD/EMI filters, SMD disk varistors (CU types), leaded transient voltage/ RFI suppressors (SHCV types)) for certain areas of application, including recommendations about incorporation/design-in of these products into customer applications. The statements are based on our knowledge of typical requirements often made of our CTVS devices in the particular areas. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our CTVS components for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always incumbent on the customer to check and decide whether the CTVS devices with the properties described in the product specification are suitable for use in a particular customer application. Do not use EPCOS CTVS components for purposes not identified in our specifications, application notes and data books. Ensure the suitability of a CTVS in particular by testing it for reliability during design-in. Always evaluate a CTVS component under worst-case conditions. Pay special attention to the reliability of CTVS devices intended for use in safety-critical applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant). Design notes Always connect a CTVS in parallel with the electronic circuit to be protected. Consider maximum rated power dissipation if a CTVS has insufficient time to cool down between a number of pulses occurring within a specified isolated time period. Ensure that electrical characteristics do not degrade. Consider derating at higher operating temperatures. Choose the highest voltage class compatible with derating at higher temperatures. Surge currents beyond specified values will puncture a CTVS. In extreme cases a CTVS will burst. If steep surge current edges are to be expected, make sure your design is as low-inductance as possible. In some cases the malfunctioning of passive electronic components or failure before the end of their service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In applications requiring a very high level of operational safety and especially when the malfunction or failure of a passive electronic component could endanger human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line applications such as clamp 30), ensure by suitable design of the application or other measures (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of such a malfunction or failure. Only use CTVS components from the automotive series in safety-relevant applications. Specified values only apply to CTVS components that have not been subject to prior electrical, mechanical or thermal damage. The use of CTVS devices in line-to-ground applications is
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therefore not advisable, and it is only allowed together with safety countermeasures like thermal fuses. Storage Only store CTVS in their original packaging. Do not open the package before storage. Storage conditions in original packaging: temperature 25 to +45C, relative humidity 75% annual average, maximum 95%, dew precipitation is inadmissible. Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise the packaging material may be deformed or CTVS may stick together, causing problems during mounting. Avoid contamination of the CTVS surface during storage, handling and processing. Avoid storing CTVS devices in harmful environments where they are exposed to corrosive gases for example (SOx, Cl). Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages. Solder CTVS components after shipment from EPCOS within the time specified: CTVS with Ni barrier termination, 12 months CTVS with AgPd termination, 6 months SHCV and CU series, 24 months Handling Do not drop CTVS components and allow them to be chipped. Do not touch CTVS with your bare hands - gloves are recommended. Avoid contamination of the CTVS surface during handling. Mounting When CTVS devices are encapsulated with sealing material or overmolded with plastic material, electrical characteristics might be degraded and the life time reduced. Make sure an electrode is not scratched before, during or after the mounting process. Make sure contacts and housings used for assembly with CTVS components are clean before mounting. The surface temperature of an operating CTVS can be higher. Ensure that adjacent components are placed at a sufficient distance from a CTVS to allow proper cooling. Avoid contamination of the CTVS surface during processing. Multilayer varistors (MLVs) with AgPd termination are not approved for lead-free soldering. Soldering Complete removal of flux is recommended to avoid surface contamination that can result in an instable and/or high leakage current. Use resin-type or non-activated flux. Bear in mind that insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
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Conductive adhesive gluing Only multilayer varistors (MLVs) with an AgPd termination are approved for conductive adhesive gluing. Operation Use CTVS only within the specified operating temperature range. Use CTVS only within specified voltage and current ranges. Environmental conditions must not harm a CTVS. Only use them in normal atmospheric conditions. Reducing the atmosphere (e.g. hydrogen or nitrogen atmosphere) is prohibited. Prevent a CTVS from contacting liquids and solvents. Make sure that no water enters a CTVS (e.g. through plug terminals). Avoid dewing and condensation. EPCOS CTVS components are mainly designed for encased applications. Under all circumstances avoid exposure to: direct sunlight rain or condensation steam, saline spray corrosive gases atmosphere with reduced oxygen content EPCOS CTVS devices are not suitable for switching applications or voltage stabilization where static power dissipation is required. Multilayer varistors (MLVs) are designed for ESD protection and transient suppression. CeraDiodes are designed for ESD protection only, ESD/EMI filters are designed for ESD and EMI protection only. This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
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Important notes
The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks.
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